Carrier with heat dissipation structure

ABSTRACT

A carrier with heat dissipation structure includes a main body. The main body is made of silicone or rubber material. The main body has a chamber having a capillary structure. A working fluid is contained in the chamber. At least one support section protrudes from a wall face of the chamber. The main body has at least one heat absorption section and a heat dissipation section. The heat dissipation section extends from at least one end of the heat absorption section. The carrier of the present invention is flexible. The carrier has an internal chamber for vapor-liquid circulation and heat exchange of the working fluid. Accordingly, the heat dissipation efficiency of the intelligent mobile device correspondingly assembled with the carrier is greatly enhanced.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to a carrier with heat dissipation structure, and more particularly to a carrier with heat dissipation structure, which is applicable to wearable intelligent mobile device for dissipating heat.

2. Description of the Related Art

Various multifunction mobile devices have been developed, including mobile phones, tablets and even intelligent wearable devices such as watches, necklaces and fingerings. Along with the addition of more and more functions, the intelligent wearable device is equipped with various electronic components such as touch screen and satellite positioning chip. Therefore, the intelligent watch is connectable to other mobile devices via Bluetooth or network. Moreover, a SIN card can be inserted into the intelligent watch to access to 3G or 4G network and make phone calls. In operation, the intelligent watch will generate heat. In addition, the entire intelligent watch is designed with a fully sealed structure for achieving waterproof effect. Under such circumstance, the heat generated by the electronic components in the intelligent watch can be hardly dissipated outward. As a result, the heat will accumulate in the interior of the watch.

The watchband of the conventional intelligent watch for a user to wear can be made of metal material, leather, rubber, plastic or the like material. All these material can hardly effectively conduct the heat generated by the intelligent watch outward to dissipate the heat. Moreover, the watchband must be flexible for a user to conveniently wear. Therefore, it is impossible to combine an inflexible heat dissipation component (such as heat pipe or vapor chamber) with the watchband for dissipation heat.

As a result, the intelligent watch is often overheated to cause deterioration of execution efficiency of the intelligent watch or even shutdown of the intelligent watch. Accordingly, it has become a critical issue how to solve the heat dissipation problem of the intelligent watch and various intelligent wearable devices.

SUMMARY OF THE INVENTION

It is therefore a primary object of the present invention to provide a carrier with heat dissipation structure. The carrier is applicable to an intelligent mobile device to effectively solve the heat accumulation problem of the intelligent mobile device.

To achieve the above and other objects, the carrier with heat dissipation structure of the present invention includes a main body. The main body is made of silicone or rubber material. The main body has a chamber having a capillary structure. A working fluid is contained in the chamber. At least one support section protrudes from a wall face of the chamber. The main body has at least one heat absorption section and a heat dissipation section. The heat dissipation section extends from at least one end of the heat absorption section. The carrier of the present invention is flexible. The carrier has an internal chamber for vapor-liquid circulation and heat exchange of the working fluid. Accordingly, the heat dissipation efficiency of the intelligent mobile device correspondingly assembled with the carrier is greatly enhanced.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:

FIG. 1 is a perspective view of a first embodiment of the carrier with heat dissipation structure of the present invention;

FIG. 2 is a sectional view of the first embodiment of the carrier with heat dissipation structure of the present invention;

FIG. 3 is a perspective sectional view of a second embodiment of the carrier with heat dissipation structure of the present invention;

FIG. 4 is a perspective exploded view of a third embodiment of the carrier with heat dissipation structure of the present invention;

FIG. 5 is a sectional view of a fourth embodiment of the carrier with heat dissipation structure of the present invention; and

FIG. 6 is a perspective exploded view of a fifth embodiment of the carrier with heat dissipation structure of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Please refer to FIGS. 1 and 2. FIG. 1 is a perspective view of a first embodiment of the carrier with heat dissipation structure of the present invention. FIG. 2 is a sectional view of the first embodiment of the carrier with heat dissipation structure of the present invention. According to the first embodiment, the carrier with heat dissipation structure of the present invention includes a main body 11.

The main body 11 is made of silicone or rubber material. The main body 11 has a chamber 111 having a capillary structure 113. A working fluid 2 is contained in the chamber 111. A support section 111 a protrudes from a wall face of the chamber 111.

The main body 11 has at least one heat absorption section 112 and a heat dissipation section 114. The heat dissipation section 114 extends from at least one end of the heat absorption section 112.

The capillary structure 113 is selected from a group consisting of mesh body, fiber body and metal wire braided body.

The support section 111 a is composed of multiple ribs (columns, points, blocks) 1111 arranged at intervals. At least one passage 1112 is formed between the ribs 1111. The passage 1112 serves as the passage of the vapor working fluid 2 in vapor-liquid circulation.

The main body 11 is made by means of injection molding (in-mold injection) or other methods. The internal chamber 111 of the main body 11 is totally vacuumed and sealed to enclose the support section 111 a and the capillary structure 113. The chamber 111 serves as a space for vapor-liquid circulation of the working fluid 2.

The carrier with heat dissipation structure of the present invention can be combined with at least one intelligent mobile device. When the intelligent mobile device generates heat, the heat absorption section 112 of the main body 11 of the wearable carrier can absorb the heat. At this time, the working fluid 2 in the chamber 111 at the heat absorption section 112 is heated and evaporated into vapor. The vapor working fluid 2 spreads within the chamber 111 to transfer heat to the heat dissipation section 114. The vapor working fluid 2 in the chamber 111 at the heat dissipation section 114 is cooled and condensed into liquid working fluid 2. The capillary structure 113 sucks the liquid working fluid 2, whereby the liquid working fluid 2 flows back to the heat absorption section 112 under the capillary attraction of the capillary structure 113 for next vapor-liquid circulation and heat exchange. The intelligent mobile device with the carrier with heat dissipation structure of the present invention is wearable by a user. Moreover, the carrier with heat dissipation structure of the present invention provides heat dissipation effect for the intelligent mobile device to prevent the heat from accumulating in the intelligent mobile device. Accordingly, the heat dissipation efficiency of the intelligent mobile device is enhanced.

Please now refer to FIG. 3, which is a perspective sectional view of a second embodiment of the carrier with heat dissipation structure of the present invention. The second embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The second embodiment is different from the first embodiment in that in the second embodiment, the support section 111 a is composed of multiple raised bodies 1113 arranged at intervals. At least one transverse passage 1112 and at least one longitudinal passage 1112 are formed between the raised bodies 1113. The passages 1112 serve as the passages of the vapor working fluid 2 in vapor-liquid circulation (as shown in FIG. 2).

Please now refer to FIG. 4, which is a perspective exploded view of a third embodiment of the carrier with heat dissipation structure of the present invention. The third embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The third embodiment is different from the first embodiment in that in the third embodiment, the main body 11 further has a rest section 12. The rest section 12 has a periphery defining a receiving space 121. The heat absorption section 112 is disposed in the receiving space 121. At least one intelligent mobile device 4 is correspondingly connected and assembled in the receiving space 121.

In this embodiment, the intelligent mobile device 4 is, but not limited to, an intelligent watch for illustration purposes only. The intelligent mobile device 4 is received in the receiving space 121 of the rest section 12 and attached to the heat absorption section 112 of the main body 11. Accordingly, the heat generated by the intelligent mobile device 4 is absorbed by the heat absorption section 112 of the main body 11 and dissipated from the heat dissipation section 114. Therefore, the heat accumulation problem of the intelligent mobile device 4 can be solved.

Please now refer to FIG. 5, which is a sectional view of a fourth embodiment of the carrier with heat dissipation structure of the present invention. The fourth embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The fourth embodiment is different from the first embodiment in that in the fourth embodiment, the chamber 111 of the main body 11 further has a coating 5 therein. The coating 5 is disposed on a surface of the chamber 111. The coating 5 serves to enhance the condensation efficiency of the working fluid 2 in the chamber 111 (as shown in FIG. 2) and help in collecting the condensed working fluid 2.

Please now refer to FIG. 6, which is a perspective exploded view of a fifth embodiment of the carrier with heat dissipation structure of the present invention. The fifth embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The fifth embodiment is different from the first embodiment in that in the fifth embodiment further includes a heat conductor 3. The heat conductor 3 is inlaid in the heat absorption section 112 of the main body 11. The heat conductor 3 has a first face 31 and a second face 32. The first face 31 of the heat conductor 3 is exposed to outer side of the main body 11. The second face 32 faces the chamber 111 of the main body 11. The capillary structure 113 extends to a position adjacent to the heat conductor 3. The heat conductor 3 is selected from a group consisting of a heat pipe, a vapor chamber and a graphite sheet. In this embodiment, the heat conductor 3 is, but not limited to, a graphite sheet for illustration purposes only.

In this embodiment, the heat conductor 3 inlaid in the heat absorption section 112 of the main body 11 is directly attached to the intelligent mobile device 4. The first face 31 of the heat conductor 3 can directly absorb the heat generated by the intelligent mobile device 4 and conduct the heat to the main body 11. The second face 32 of the heat conductor 3 serves to conduct the heat into the chamber 111, whereby the working fluid 2 in the chamber 111 of the main body 11 at the heat absorption section 112 is evaporated to spread to the heat dissipation section 114. Then the vapor working fluid 2 at the heat dissipation section 114 is cooled and condensed into liquid working fluid 2. The capillary structure 113 then sucks the liquid working fluid 2, whereby the liquid working fluid 2 flows back to the heat conductor 3 under the capillary attraction of the capillary structure 113 for next vapor-liquid circulation. Accordingly, the heat generated by the intelligent mobile device 4 can be dissipated.

The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims. 

What is claimed is:
 1. A carrier with heat dissipation structure comprising a main body, the main body being made of silicone or rubber material, the main body having a chamber having a capillary structure, a working fluid being contained in the chamber, a support section protruding from a wall face of the chamber, the main body having at least one heat absorption section and a heat dissipation section, the heat dissipation section extending from at least one end of the heat absorption section.
 2. The carrier with heat dissipation structure as claimed in claim 1, wherein the capillary structure is selected from a group consisting of mesh body, fiber body and metal wire braided body.
 3. The carrier with heat dissipation structure as claimed in claim 1, wherein the main body further has a rest section correspondingly assembled with the heat absorption section, the rest section having a receiving space, whereby at least one intelligent mobile device can be correspondingly connected and assembled in the receiving space.
 4. The carrier with heat dissipation structure as claimed in claim 1, wherein the support section is composed of multiple ribs arranged at intervals.
 5. The carrier with heat dissipation structure as claimed in claim 1, further comprising a heat conductor inlaid in the heat absorption section of the main body, the heat conductor having a first face and a second face, the first face being exposed to outer side of the main body, the second face facing the chamber of the main body, the capillary structure extending to a position adjacent to the second face of the heat conductor, the heat conductor being selected from a group consisting of a heat pipe, a vapor chamber and a graphite sheet.
 6. The carrier with heat dissipation structure as claimed in claim 1, wherein the support section is composed of multiple raised bodies arranged at intervals.
 7. The carrier with heat dissipation structure as claimed in claim 1, wherein the chamber of the main body further has a coating therein. 